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Home> Aircraft Maintenance Articles Aircraft Electrical Bonding
Bonding reduces electrostatic EMI by preventing the build-up and subsequent discharge of static charges. Bonding prevents surfaces from electrically resonating and radiating EMI. Bonding eliminates harmonic EMI by eliminating current rectification at contact surfaces. Bonding assures that all parts are at the same potential which prevents higher RF current flow in one part of the structure than another. All RF generators should have a low-impedance path to ground; bonding assures this. The engine should have a good ground to the engine mount. Sometimes an aluminum clamp is used around the engine mount. This makes a poor RF ground. The dissimilar metals oxidize and form a high impedance ground path. Poor grounds caused by oxidation can in themselves create and radiate RF fields by rectifying current. Any corroded joint in which ground currents are flowing can rectify current and transmit RF radiation. A rectifier passes current in one direction and opposes the flow of current in the opposite direction. A common manmade rectifier is a diode. In nature, rectifiers are common in the presence of high intensity RF fields. Corroded magneto distributor cap contact springs (the ones in the towers where the harness fits into) can radiate large amounts of RF into avionics. Cleaning the contact springs with contact cleaner usually helps. A good ground for RF frequencies is much harder to achieve than a good DC ground. As current frequency increases from DC to AC, the opposition to current flow becomes less resistive and more dependent upon the capacitive and inductive characteristics of the ground connection. Thus, a good RF ground has low DC resistance and reactance. This is generally accomplished by having:
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